M5 Pro chip could separate CPU and GPU

Apple insider and analyst Ming-Chi Kuo has revealed a slew of new information about Cupertino's upcoming M5-series processors ...
Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a ...
Apple's new M5 Pro, M5 Max, and M5 Ultra chips will reportedly use server-grade SoIC packaging, with the iPhone giant to use ...
In a blog post on Medium, Apple insider Ming-Chi Kuo revealed interesting details about Apple's future iPhone 18 and M5 Mac ...
Apple's high-end M5 chip variants might feature a new design that separates the CPU and GPU into server-grade chips.