Chinese memory company Tongu announces HBM2 trial production: should find its way into Huawei AI chips, as HBM3E rules and ...

Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.

Nvidia CEO Jensen Huang stated that Samsung Electronics (Samsung) must develop a "new design" to pass Nvidia's qualification, ...

SEOUL, Jan. 28 (Korea Bizwire) — The emergence of Chinese AI startup DeepSeek has sent shockwaves through the global tech ...

SEOUL, Jan. 28 (Yonhap) -- Chipmaking giant SK hynix Inc. has surpassed its biggest rival, Samsung Electronics Inc., for the ...

At CES 2025, Nvidia CEO Jensen Huang publicly addressed challenges regarding Samsung Electronics' HBM3E memory design, marking his first explicit acknowledgment of the issues that have sparked ...

TL;DR: SK hynix will showcase its new 16-Hi HBM3E memory chips at CES 2025, featuring up to 48GB capacity. These chips use an advanced manufacturing process to enhance performance and control warpage.

During the event, the company will exhibit samples of its 16-layer HBM3e product, which boasts the highest capacity — 48 gigabytes — and the highest stack configuration with 16 layers.

However, SK's shares dropped by as much as 4.7 percent after chief financial officer Kim Woo-hyun warned of weaker demand ...

The company’s Q4 revenue increased by 12%, and its operating profit rose by 15%, making for its best quarter ever, SK Hynix ...