Micron Technology, long the third-largest player in the global memory semiconductor market behind South Korea’s Samsung ...

The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new ...

SK hynix will showcase its advanced HBM memory chips for AI GPUs at CES 2025 as the 'full-stack AI memory provider' with ...

At its CES exposition, AMD demonstrated its latest Instinct MI325X accelerator for AI and HPC workloads, which also happens ...

Samsung Electronics expects lower operating profit due to R&D costs and weak demand for memory chips. Nvidia approves Samsung ...

SK Group showcased innovative AI and data center technology, including the world's first 16-layer HBM3E memory chips. The ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Nvidia CEO Jensen Huang publicly addressed challenges regarding Samsung Electronics' HBM3E memory design, marking his first ...

Samsung Electronics "has to engineer a new design" to pass Nvidia's verification test for its high bandwidth memory (HBM) ...

SK hynix is preparing to showcase its industry-leading AI memory technologies at CES 2025: including HBM3E, 122TB SSDs, and ...

Micron has already demonstrated traction in the market with its HBM3E technology. "We are proud to share that Micron's HBM3E 8H is designed into Nvidia’s Blackwell B200 and GB200 platforms ...