The 321-layer NAND was made possible by SK Hynix’s "Three Plugs" process technology, which involves electrically connecting ...
SK Hynix recently released its new 1-terabit 4D NAND chips, setting a new record. The company is on a streak as it was also ...
SK Hynix, the world’s second-largest memory chipmaker, recently became the first to mass-produce triple-level cell (TLC) NAND flash with over 300 layers. The company’s new 321-layer ...
Samsung plans to provide details on its new 1Tb 400-layer triple-level cell (TLC) NAND at the International Solid-State Conference (ISSCC) 2025 which will be held in the US in February 2025.
Zhitai's TiPro9000 SSD with 5th Gen YMTC 3D NAND and Silicon Motion SM2508 SSD controller benchmarked, appears to be one of ...
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